Please use this identifier to cite or link to this item: https://scholarhub.balamand.edu.lb/handle/uob/2239
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dc.contributor.authorShirakawa, Alexandre.Aen_US
dc.contributor.authorHassan, Moustapha Elen_US
dc.contributor.authorPham, Jean-Marieen_US
dc.contributor.authorJarry, Pierreen_US
dc.contributor.authorKerherve, Ericen_US
dc.contributor.authorDavid, Jean-Baptisteen_US
dc.contributor.authorDumont, Fabienen_US
dc.contributor.authorBelot, Didieren_US
dc.date.accessioned2020-12-23T09:09:16Z-
dc.date.available2020-12-23T09:09:16Z-
dc.date.issued2008-
dc.identifier.urihttps://scholarhub.balamand.edu.lb/handle/uob/2239-
dc.description.abstractThis paper address design guidelines for improving the rejection of ladder bulk acoustic wave filters. An overview of the bulk acoustic wave filters technology enables to outcome the principal features of ladder filters. The lack of out-of-band rejection is currently an important weakness of this topology. The design technique presented enables to improve bulk acoustic wave ladder filters rejection by using their input/output bonding wires. Finally, the technique is used for design and fabrication of a bulk acoustic wave ladder filter for application in W-CDMA reception (2.11–2.17 GHz) front-ends. The filter measurement results show a significant improvement on the filter rejection at the transmission band (from −19 to 34 dB) and on the return loss (from −10 to −16 dB) without considerable modification of filter insertion loss and selectivity.en_US
dc.format.extent6 p.en_US
dc.language.isoengen_US
dc.subjectBAW filteren_US
dc.subjectSMRen_US
dc.subjectLaddersen_US
dc.titleMethod for improving ladder bulk acoustic wave filters rejectionen_US
dc.typeJournal Articleen_US
dc.contributor.affiliationDepartment of Electrical Engineeringen_US
dc.description.volume55en_US
dc.description.issue1en_US
dc.description.startpage69en_US
dc.description.endpage75en_US
dc.date.catalogued2017-11-28-
dc.description.statusPublisheden_US
dc.identifier.ezproxyURLhttp://ezsecureaccess.balamand.edu.lb/login?url=https://link.springer.com/article/10.1007/s10470-008-9155-zen_US
dc.identifier.OlibID175273-
dc.relation.ispartoftextJournal of analog integrated circuits and signal processingen_US
dc.provenance.recordsourceOliben_US
Appears in Collections:Department of Electrical Engineering
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